The DSS-200 scrubs, rinses and dries six to eight inch (150 mm - 200 mm) wafers. It consists of system electronics, a send indexer, an outside, inside brush station, spin station and robotic edge handling receive handler.

Customized systems may include four to eight inch (100 mm - 200 mm) wafer processing configurations, wet or dry send indexers, electronic enclosure mounting on either side of the cabinet or as a stand alone unit, and numerous input power options.